According to the requirements of automatic wire bonding machine, CoreMorrow produces piezo clamp, which is designed and developed for clamping wire. It feaures a simple structure, fast response and high resolution.
Features
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Displacement vs Voltage ![]() |
Recommended Controller E53.A piezo controller is ideal for driving the piezo clamp, ensuring fast response times and ensuring the stability of the piezo clamps. E53 is very compactand easy to integrate. ![]() |
Principle The structure of piezo clamps is composed of piezo stacks, flexible mechanical structure, fixed jaw and adjustable jaw. Piezo stack is installed between clamping jaw and the base. When voltage is applied to piezo stack, the output displacement of the piezo stack is amplified by the lever arm of the clamping jaw to the position where the top end of the clamp is clamped. Control the clamp to hold the gold wire. After the voltage is removed, the of clamp jaws return to initial position. |
Applications
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Technical data | |||||||
Models |
XD002.80K |
XD002.90K |
XD002.100K |
XD002.150K |
XD002.200S |
XD002.250K |
Units |
Active axes |
X | X | X |
X |
X(闭环) |
X |
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Travel range(0~120V) |
±32 |
±36 |
±40 |
±60 |
±80 |
±150 |
μm±20% |
Max.travel range(0~150V) |
±40 |
±45 |
±50 |
±75 |
±100 |
±190 |
μm±20% |
Push/pull force capacity |
- | 10/1 | - | - |
4/- |
- |
N |
Stiffness |
- | 0.04 | - | - |
0.04 |
- |
N/μm±20% |
No load resonant frequency |
42000 | 1500 | 1050 | 1100 |
400 |
660 |
Hz±20% |
No load Step time |
0.075 | 0.7 | - | - |
- |
- |
ms±20% |
No load Operating frequency |
- | 300 | - | - |
- |
- |
Hz |
Load capacity |
0.05 | 0.05 | 0.05 |
0.05 |
0.05 |
0.1 |
kg |
Electrical capacitance |
0.18 | 0.18 | 0.18 | 0.17 |
7.2 |
4.85 |
μF±20% |
Material |
Ti | Stainless steel | Steel |
Steel |
Steel |
Stainless steel |
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Mass |
12(Cable included) | 10 |
10 |
8.7 |
305 |
215(Cable included) |
g±5% |
Power-on jaw status |
Open | Open | Open | Open |
Close |
Close |
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Note:
1, Customizable clamping displacement up to 500 μm and 1000 μm types;
2. Connector can be customized. Low temperature version and high vacuum version can be customized.
3.The parameters mentioned are related to the test environment and test equipment.
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