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Piezoelectric Nanotechnology has Shown its Prowess in Adhesive Coating and Developing Equipment

In the photolithography process of semiconductor manufacturing, coating and developing equipment and photolithography machines need to work in coordination to jointly achieve precise photolithography processes. Before the exposure process, the photoresist will be evenly coated on the surface of the wafer. After the exposure is completed, the developing equipment processes the wafer and develops the photolithography pattern formed by the exposure. The entire process has extremely high requirements for equipment performance. It is necessary to complete the response within milliseconds while ensuring nanomet-level operational accuracy. Only in this way can the accuracy and stability of the photolithography process be guaranteed, and the manufacturing quality of semiconductor devices be ensured.

(Note: Image from online resources)

        The Photoresist Application Process：

The photoresist is evenly coated on the wafer surface through spin coating or spray coating. There are static spin coating and dynamic spin coating. Static spin coating is a process where glue is dropped while the wafer is stationary. The turntable drives the wafer to rotate, completing the process of glue ejection and solvent evaporation. Dynamic spin coating is a process in which the wafer undergoes low-speed rotation while dripping glue, and then accelerates the rotation to complete the glue ejection and solvent evaporation. The photoresist spraying is to spray the photoresist onto the wafer surface in the form of "glue mist" through the glue nozzles that move back and forth along a specific trajectory by the glue spraying equipment.

(Note: Image from online resources)

(Note: Image from online resources)

The key to applying adhesive lies in controlling the thickness and uniformity of the adhesive film, and it is necessary to precisely control parameters such as the rotational speed and the landing point of the sprayed adhesive.  

During the development process, the positioning accuracy of the wafer and the uniformity of the developer spray directly affect the line width accuracy and edge roughness of the pattern.

Characteristics

▲6-axis motion of X, Y, Z, θx, θy, and θz

▲ Optional closed-loop feedback sensor

▲Load capacity up to 10kg

▲Ultra-high resolution

       Technical Data

       H64A.XYZTR2S/K-C is a piezo nanopositioning platform that can generate ultra precision motion in 6 axes, suitable for positioning and attitude adjustment. It adopts a parallel mechanism design internally, which can achieve better dynamic performance. It is equipped with high-performance piezos, which can achieve linear displacement of ±9μm in X, ±9.5μm in Y, 155μm in Z and deflection angle of ±1.1mrad in θx,θy, ±1mrad in θz. The closed-loop version of the full bridge design avoids temperature drift significantly and ensures nanometer positioning accuracy.。

Characteristics

▲Moves in X, Y, Z, θx, θy, θz

▲Linear stroke to X±9/Y±9.5/Z155μm

▲Angular stroke to θxθy±1.1/θz±1mrad

▲Closed-loop version for high positioning accuracy

▲Parallel mechanism, better dynamics

▲Load capacity to 12kg

       Technical Data

Note: The above parameters were measured with E00.D6K04 piezo controller. The limit of the driving voltage can be within -20V to 150V. For highly reliable long-term use, it is recommended that the driving voltage between 0 and 120V.

       The cylindrical piezo actuator is to package the piezo stack into a steel casing and apply preload to the piezo stacks. The high internal mechanical preload makes the piezo stacks suitable for high-load and high-dynamic applications. It can output the displacement and output force generated by the piezo stacks, and can withstand a certain tensile force.

       √Direct Drive Structure： 

The ceramic actuator adopts a piezo ceramic direct drive structure, featuring high blocking force and fast response speed. It can be optionally equipped with sensors for closed-loop feedback. The top and bottom of the piezo ceramic actuator are fixed respectively by threads. The fixing method can be customized, such as external thread, internal thread, Spherical and plane, etc.

Characteristics

▲Nanoscale resolution

▲Bear a certain tensile force

▲High closed-loop accuracy

▲Travel to 190μm

▲Blocking force to 25000N

       Technical Data

       Metal-sealed preloaded piezo actuators have a fully sealed casing, achieving insulation from the atmospheric environment and being less affected by environmental humidity. They have a longer service life and higher performance, making them very suitable for various applications such as semiconductor device manufacturing equipment and optical communication equipment that require high reliability.

       Characteristics

       ▲High reliability: Realization of MTTF=36,000 hours at 85°C and 100 V

       ▲Accurate nanometer positioning

       ▲Minimum mechanical abrasion

       ▲Operation temperature:：−25℃ ~+85℃（H&S series）or -40~150℃ (T series)

       ▲Blocking force to 3600N 3600N

       ▲Driving Voltage：0~150V0~150V

       ▲Built-in pre-load mechanism and mounting attachments allowing for easier installation into equipment

Note: MTTF: Mean Time To Failures

       Typical Model

H550C801WD1-A0LF is one of CoreMorrow preloaded piezo actuators. It has 55μm displacement and 800N force. The high-standard performance makes it very suitable for driving fluid flow control valves, meeting the high reliability and high precision requirements of fluid flow control valves for driving components. There are other models and custom specifications available for your option.

       Technical Data

For further details, please call +86-451-86268790, or add WeChat ID: 17051647888.