(Note: Image from online resources)

Etching technology is an indispensable part of the chip manufacturing process. Etching machines are used in semiconductor manufacturing for etching processes. Their core function is to selectively remove specific material layers on the surface of wafers, permanently transferring the photoresist patterns defined by the photolithography process to the actual material layers below (such as silicon, oxides, metals, etc.), and ultimately forming key structures such as transistors, interconnects, and grooves inside the chip.

Etching equipment is mainly classified into wet etching and dry etching based on the differences in processes. Wet etching usually employs chemical solutions, while dry etching typically uses plasma or specific gases. At present, in pursuit of higher precision in semiconductor manufacturing, especially in advanced processes, dry etching is mostly adopted. The core principle of dry etching is as follows: a specific etching gas is introduced into the reaction chamber of the etching machine. The gas is ionized by a radio frequency power supply to form plasma, which then undergoes a chemical reaction with the target material on the wafer surface. The products generated by the reaction are removed, thereby precisely transferring the pattern on the photoresist to the material layer below.

(Note: Image from online resources)

In summary, etching machines, like photolithography machines, are key equipment for forming patterns on semiconductor chips, and their precision directly determines the integration and performance of the chips.

As chip manufacturing processes progress from 14nm to 3nm, 2nm, and even more advanced nodes in the future, the dimensional accuracy and shape control of etching are gradually approaching physical limits.

(Note: Image from online resources)

(Note: Image from online resources)

The core advantage of piezo nano-positioning technology lies in its low-energy consumption precision motion control with nanoscale resolution and millisecond-level response speed.

1. Nanoscale Displacement Adjustment of Wafers

The positioning accuracy of the wafer during the etching process directly affects the process effect. The piezo nano-positioning stage can perform multi-dimensional precise angle adjustment, featuring extremely high positioning accuracy and stability, with a fast response speed. It can ensure the ideal relative position between the wafer and the plasma flow, eliminating the etching deviation problem caused by offset.

(Note: Image from online resources)

2. Control of Etching Morphology

Facing the etching challenges of stereo circuits on chips, piezo ceramic actuators can assist RF electrodes in fine-tuning, real-time correcting the position of the plasma beam, optimizing the plasma distribution, achieving undamaged etching shapes and distortion-free line width, and meeting the precise etching requirements of key structures in chips. Meanwhile, the lifespan of high-performance piezoelectric actuators exceeds one billion reciprocating cycles, which can meet the long-term mass production demands of etching machines.

(Note: Image from online resources)

3.Microfluidic Control of Etching Gas

The flow rate of the etching gas needs to be precise to the error level of less than 0.1%, and the gas formula needs to be switched within milliseconds, such as from the etching medium layer to the etching metal layer, etc. This requires the adoption of high-precision mass flow controllers (MFC), and the response time of the internal valves of the MFC also needs to be controlled at the millisecond level. Moreover, the accuracy and stability should be minimized after long-term use.

(Note: Image from online resources)

Characteristics

    • 2 axes or 3 axes, travel to 300μm/axis

    • Frictionless, high precision flexible guiding system

    • Closed-loop sensor available

    • High scanning flatness

    • Multiple sizes of aperture available

    • UHV version available

Technical Data

Note: Custom ultra-low temperature version and UHV version available.

Characteristics

    • Motion in X, Y, Z, θx, θy, θz

    • Small coupling

    • Closed-loop version for high accuracy

    • No accumulation of error

Technical Data

Note: Custom low temperature version and HV version available.

Characteristics

▲ High reliability: Realization of MTTF=36,000 hours at 85°C and 100 V

▲ Accurate nanometer positioning

▲ Minimum mechanical abrasion

▲ Operation temperature:−25℃ ~+85℃（H&S series）or -40~150℃ (T series)

▲ Blocking force to 3600N

▲ Driving Voltage：0~150V

▲ Built-in pre-load mechanism and mounting attachments allowing for easier installation into equipment

Note: MTTF: Mean Time To Failures

Typical Model

H550C801WD1-A0LF is one of CoreMorrow preloaded piezo actuators. It has 55μm displacement and 800N force. The high-standard performance makes it very suitable for driving fluid flow control valves, meeting the high reliability and high precision requirements of fluid flow control valves for driving components. There are other models and custom specifications available for your option.

Technical Data

Model	H550C801WD1-A0LF
Displacement	55±8μm
Generated force	800N
Capacitance	6.4μF
Resonance Frequency	18kHz
Type	Without flange
Weight	16g
Working temperature	-25~85℃
Length	44.4±0.5mm

For further details, please call +86-451-86268790, or add WeChat ID: 17051647888.