▸ 1.Nanometer-level Resolution and High Precision: The drive of the stage is derived from the direct microscopic deformation of piezo materials, without the need for conversion through intermediate transmission mechanisms, fundamentally avoiding the influence of factors such as backlash and friction. Through high-performance closed-loop control, nanometer-level resolution and positioning accuracy can be easily achieved.

▸ 2.Millisecond-level Response: The response time of piezo ceramics is typically in the millisecond range, which enables the stage to perform high-speed and high-frequency scanning and positioning movements, meeting the requirements of dynamic applications.

▸ 3.High Stiffness and Strong Blocking Force:  Piezo ceramics can generate a considerable force when deformed, which endows the moving platform with extremely high static and dynamic stiffness.

▸ 4. Clean and Non-magnetic:The piezo drive process does not generate electromagnetic fields and will not produce wear particles due to relative motion. This makes it highly suitable for scenarios with high requirements for vacuum environments and cleanliness, as well as for precise measurement occasions where electromagnetic interference needs to be avoided.

▸ 1.Enhance the directional consistency of stiffness: When the load approaches 10kg and dynamic scanning or positioning needs to be carried out within an 80μm stroke, this circular structure naturally possesses higher symmetry. Through optimized design, it helps to achieve more consistent stiffness and dynamic response characteristics in X and Y axes, ensuring that the stage's motion accuracy is more uniform throughout the entire plane under heavy load conditions.

▸ 2.Optimized load stress distribution: The circular profile enables the stress generated by the load to be more smoothly transferred to the flexible hinge system, which is conducive to improving the structural stability and fatigue life under long-term heavy-load operation, ensuring long-term precision stability from the design perspective.

▸ 3.Enhanced compatibility: The circular platform design breaks the installation orientation restrictions of the load, enabling adaptation to various uses, significantly improving equipment integration efficiency, and providing greater freedom in connection with the load. In addition, many precision processing and inspection scenarios require the coordination of translational and rotational movements. The circular platform provides physical and conceptual convenience for subsequent integration with the rotating axis, making it easy to achieve coaxial alignment and simplifying the design of multi-degree-of-freedom systems.

▸ 1.Transmission Light Application: Perfectly compatible with near-field scanning, confocal microscopy, mask positioning and other transmission light scenarios. The circular light passage hole is more in line with the circular characteristics of the optical path, effectively avoiding occlusion and improving imaging quality;

▸ 2.Precision Leveling Scenarios: In wafer processing or optical lens inspection, the sample platform needs to be dynamically leveled at the micrometer or even nanometer scale. The symmetrical structure and uniform force-bearing characteristics of P15A.XYZ50S25 can effectively ensure the stability and repeatability of the leveling process;

▸ 3.Special Environment Adaptation: Thanks to its frictionless structural design, the vacuum version P15A.XYZ50S25 can operate stably in special environments such as vacuum and clean rooms without generating particles, meeting the demands of high-end scenarios like semiconductor manufacturing and metrology calibration.